SOC
MediaTek Dimensity 8350
About
The MediaTek Dimensity 8350 is a SOC manufactured by MediaTek, built on MediaTek's officially announced 4 nm process technology. This processor features a 8-core architecture design, equipped with 4 MB of L3 cache. Overall specifications are targeted at mainstream high-performance application scenarios.
Specifications
CPU
Architecture
1x 3.35 GHz – Cortex-A7153x 3.2 GHz – Cortex-A7154x 2.2 GHz – Cortex-A510
Frequency
3350 MHz
Cores
8
Instruction set
ARMv9-A
L3 cache
4 MB
Process
4 nm
Manufacturing
TSMC
Graphics
GPU name
Mali-G615 MP6
GPU frequency
1400 MHz
Shading units
128
Vulkan version
1.3
OpenCL version
2.0
Memory
Memory Type
LPDDR5X
Memory frequency
4266 MHz
Bus
4x 16 Bit
Max bandwidth
68.2 Gbit/s
AI
NPU
MediaTek APU 780
Multimedia (ISP)
Storage type
UFS 4.0
Max display resolution
2960 x 1440
Max camera resolution
1x 320MP
Video capture
4K at 60FPS
Video playback
4K at 60FPS
Video codecs
- H.264- H.265- AV1- VP9
Audio codecs
- AAC LC- FLAC- HE-AACv1- HE-AACv2- MP3
Connectivity
4G support
LTE Cat. 24
5G support
Yes
Download speed
Up to 5170 Mbps
Wi-Fi
6
Bluetooth
5.4
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Info
Announced
Nov 2024
Class
Mid range
Model number
MT6897 MT6897Z_A/ZA MT8792Z/NA
Official page
Benchmarks
Performance Ranking
Geekbench 6 Single Core
Geekbench 6 Multi Core
Related Comparisons
MediaTek Dimensity 8350 vs Qualcomm Snapdragon X Plus (X1P-64-100)
MediaTek Dimensity 8350 vs HiSilicon Kirin 9010
MediaTek Dimensity 8350 vs Qualcomm Snapdragon 7 Gen 1
MediaTek Dimensity 8350 vs MediaTek Dimensity 800U
MediaTek Dimensity 8350 vs Qualcomm Snapdragon X Elite (X1E-84-100)
MediaTek Dimensity 8350 vs Unisoc Tiger T610
MediaTek Dimensity 8350 vs HiSilicon Kirin 820
MediaTek Dimensity 8350 vs Qualcomm Snapdragon 632