SOC

HiSilicon Kirin 9000

36 Specifications

About

The HiSilicon Kirin 9000 is a SOC manufactured by , built on 's officially announced AI accelerator process technology. This processor features a 8-core architecture design. The Thermal Design Power (TDP) is rated at 6 W. Overall specifications are targeted at mainstream high-performance application scenarios.

Specifications

CPU

Architecture

1x 3.13 GHz – Cortex-A773x 2.54 GHz – Cortex-A774x 2.05 GHz – Cortex-A55

Frequency

3130 MHz

Cores

8

Instruction set

ARMv8.2-A

Process

5 nm

Transistor count

15.3

TDP

6 W

Manufacturing

TSMC

Graphics

GPU name

Mali-G78 MP24

GPU frequency

759 MHz

Execution units

24

Shading units

64

Vulkan version

1.3

OpenCL version

2.0

DirectX version

12

Memory

Memory Type

LPDDR5

Memory frequency

2750 MHz

Bus

4x 16 Bit

Max bandwidth

44 Gbit/s

Multimedia (ISP)

Neural processor (NPU)

AI accelerator

Storage type

UFS 3.1

Max display resolution

3840 x 2160

Video capture

4K at 60FPS

Video playback

4K at 60FPS

Video codecs

H.264, H.265, VP9

Audio codecs

AAC, AIFF, CAF, MP3, MP4, WAV

Connectivity

4G support

LTE Cat. 24

5G support

Yes

Download speed

Up to 4600 Mbps

Upload speed

Up to 2500 Mbps

Wi-Fi

6

Bluetooth

5.2

Navigation

GPS, GLONASS, Beidou, Galileo, NAVIC

Info

Announced

Oct 2020

Class

Flagship

Official page

Official Link ↗

Benchmarks

Geekbench 6 Single Core 1266

Geekbench 6 Multi Core 3529

FP32 (float) 2331

Performance Ranking

Geekbench 6 Single Core

56 Qualcomm Snapdragon 7 Gen 4 1352

57 HiSilicon Kirin 9000S 1334

58 Apple A12 Bionic 1301

59 MediaTek Dimensity 8350 1285

60 HiSilicon Kirin 9000 1266

61 Qualcomm Snapdragon 888 Plus 1230

62 Qualcomm Snapdragon 7s Gen 4 1214

63 MediaTek Dimensity 7350 1195

64 Qualcomm Snapdragon 7s Gen 3 1178

Geekbench 6 Multi Core

58 Google Tensor G2 3802

59 Qualcomm Snapdragon 888 Plus 3778

60 MediaTek Dimensity 8020 3709

61 MediaTek Dimensity 8100 3633

62 HiSilicon Kirin 9000 3529

63 Qualcomm Snapdragon 7 Gen 3 3375

64 Qualcomm Snapdragon 870 3336

65 MediaTek Dimensity 1100 3332

66 Qualcomm Snapdragon 7s Gen 4 3314

Related Comparisons

HiSilicon Kirin 9000 vs Qualcomm Snapdragon 665 HiSilicon Kirin 9000 vs MediaTek Helio G99 HiSilicon Kirin 9000 vs MediaTek Dimensity 6300 HiSilicon Kirin 9000 vs Samsung Exynos 2400 HiSilicon Kirin 9000 vs Qualcomm Snapdragon 8 Elite HiSilicon Kirin 9000 vs MediaTek Dimensity 7360 HiSilicon Kirin 9000 vs Qualcomm Snapdragon 720G HiSilicon Kirin 9000 vs Qualcomm Snapdragon X Plus (X1P-42-100)