SOC

MediaTek Dimensity 8300

MediaTek 33 Specifications

About

The MediaTek Dimensity 8300 is a SOC manufactured by MediaTek, built on MediaTek's officially announced MediaTek APU 780 process technology. This processor features a 8-core architecture design, equipped with 4 MB of L3 cache. Overall specifications are targeted at mainstream high-performance application scenarios.

Specifications

CPU

Architecture

1x 3.35 GHz – Cortex-A7153x 3.2 GHz – Cortex-A7154x 2.2 GHz – Cortex-A510

Frequency

3350 MHz

Cores

8

Instruction set

ARMv9-A

L3 cache

4 MB

Process

4 nm

Manufacturing

TSMC

Graphics

GPU name

Mali-G615 MP6

GPU frequency

1400 MHz

Execution units

6

Vulkan version

1.3

OpenCL version

2.0

Memory

Memory Type

LPDDR5X

Memory frequency

4266 MHz

Bus

4x 16 Bit

Max bandwidth

68.2 Gbit/s

Multimedia (ISP)

Neural processor (NPU)

MediaTek APU 780

Storage type

UFS 4.0

Max display resolution

2960 x 1440

Max camera resolution

1x 320MP

Video capture

4K at 60FPS

Video playback

4K at 60FPS

Video codecs

H.264, H.265, AV1, VP9

Audio codecs

AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC

Connectivity

5G support

Yes

Download speed

Up to 7900 Mbps

Upload speed

Up to 4200 Mbps

Wi-Fi

6

Bluetooth

5.4

Navigation

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Info

Announced

Nov 2023

Class

Flagship

Official page

Official Link ↗

Benchmarks

AnTuTu 10 1549153

Geekbench 6 Single Core 1506

Geekbench 6 Multi Core 4844

Performance Ranking

Geekbench 6 Single Core

49 MediaTek Dimensity 8450 1617

50 HiSilicon Kirin 9020 1603

51 MediaTek Dimensity 9000 1599

52 MediaTek Dimensity 8400 1571

53 MediaTek Dimensity 8300 1506

54 HiSilicon Kirin 9010 1442

55 Google Tensor G2 1439

56 Qualcomm Snapdragon 7 Gen 4 1352

57 HiSilicon Kirin 9000S 1334

Geekbench 6 Multi Core

44 Qualcomm Snapdragon 8s Gen 3 5570

45 Qualcomm Snapdragon 8 Gen 2 5344

46 HiSilicon Kirin 9020 5129

47 Qualcomm Snapdragon 7 Plus Gen 3 5098

48 MediaTek Dimensity 8300 4844

49 MediaTek Dimensity 9000 Plus 4517

50 HiSilicon Kirin 9010 4471

51 Qualcomm Snapdragon 7 Plus Gen 2 4419

52 MediaTek Dimensity 8350 4325

Related Comparisons

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