SOC

Qualcomm Snapdragon 778G Plus

Qualcomm 38 Specifications

About

The Qualcomm Snapdragon 778G Plus is a SOC manufactured by Qualcomm, built on Qualcomm's officially announced Hexagon 770 process technology. This processor features a 8-core architecture design. The Thermal Design Power (TDP) is rated at 5 W. Overall specifications are targeted at mainstream high-performance application scenarios.

Specifications

CPU
Architecture
1x 2.5 GHz – Kryo 670 Prime (Cortex-A78)3x 2.2 GHz – Kryo 670 Gold (Cortex-A78)4x 1.9 GHz – Kryo 670 Silver (Cortex-A55)
Frequency
2500 MHz
Cores
8
Instruction set
ARMv8.4-A
L2 cache
0
Process
6 nm
TDP
5 W
Manufacturing
TSMC
Graphics
GPU name
Adreno 642
GPU frequency
550 MHz
Execution units
2
Shading units
384
Vulkan version
1.1
OpenCL version
2.0
DirectX version
12.1
Memory
Memory Type
LPDDR5
Memory frequency
3200 MHz
Bus
2x 16 Bit
Max bandwidth
25.6 Gbit/s
Multimedia (ISP)
Neural processor (NPU)
Hexagon 770
Storage type
UFS 2.2, UFS 3.0, UFS 3.1
Max display resolution
2520 x 1080
Max camera resolution
1x 192MP
Video capture
4K at 30FPS
Video playback
4K at 30FPS
Video codecs
H.264, H.265, VP8, VP9
Audio codecs
AAC, AIFF, CAF, MP3, MP4, WAV
Connectivity
4G support
LTE Cat. 24
5G support
Yes
Download speed
Up to 3700 Mbps
Upload speed
Up to 1600 Mbps
Wi-Fi
6
Bluetooth
5.2
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC
Info
Announced
Oct 2021
Class
Mid range
Model number
SM7325-AE
Official page

Benchmarks

AnTuTu 10 616678
Geekbench 6 Single Core 1069
Geekbench 6 Multi Core 3008
FP32 (float) 844

Performance Ranking

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