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HiSilicon Kirin 990 4G
SOC
The HiSilicon Kirin 990 4G is a SOC manufactured by , built on 's officially announced Da Vinci process technology. This processor features a 8-core architecture design. The Thermal Design Power (TDP) is rated at 6 W. Overall specifications are targeted at mainstream high-performance application scenarios.
CPU
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Architecture
2x 2.86 GHz – Cortex-A762x 2.09 GHz – Cortex-A764x 1.86 GHz – Cortex-A55
Frequency
2860 MHz
Cores
8
Instruction set
ARMv8.2-A
L1 cache
512 KB
L2 cache
0
Process
7 nm
Transistor count
8
TDP
6 W
Manufacturing
TSMC
Graphics
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GPU name
Mali-G76 MP16
GPU frequency
600 MHz
Execution units
16
Shading units
36
Vulkan version
1.3
OpenCL version
2.0
DirectX version
12
Memory
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Memory Type
LPDDR4X
Memory frequency
2133 MHz
Bus
4x 16 Bit
Max bandwidth
34.1 Gbit/s
Multimedia (ISP)
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Neural processor (NPU)
Da Vinci
Storage type
UFS 2.1, UFS 3.0
Max display resolution
3360 x 1440
Video capture
4K at 60FPS
Video playback
4K at 60FPS
Video codecs
H.264, H.265, VC-1
Audio codecs
AIFF, CAF, MP3, MP4, WAV
Connectivity
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4G support
LTE Cat. 19
5G support
No
Download speed
Up to 1400 Mbps
Upload speed
Up to 200 Mbps
Wi-Fi
6
Bluetooth
5.0
Navigation
GPS, GLONASS, Beidou, Galileo
Info
Report📊 Benchmark
AnTuTu 10 Single
695,853
Geekbench 6 Single
990
Geekbench 6 Multi
3,179
FP32 (float) Single
691