SOC

HiSilicon Kirin 990 4G

38 Specifications

About

The HiSilicon Kirin 990 4G is a SOC manufactured by , built on 's officially announced Da Vinci process technology. This processor features a 8-core architecture design. The Thermal Design Power (TDP) is rated at 6 W. Overall specifications are targeted at mainstream high-performance application scenarios.

Specifications

CPU

Architecture

2x 2.86 GHz – Cortex-A762x 2.09 GHz – Cortex-A764x 1.86 GHz – Cortex-A55

Frequency

2860 MHz

Cores

8

Instruction set

ARMv8.2-A

L1 cache

512 KB

L2 cache

0

Process

7 nm

Transistor count

8

TDP

6 W

Manufacturing

TSMC

Graphics

GPU name

Mali-G76 MP16

GPU frequency

600 MHz

Execution units

16

Shading units

36

Vulkan version

1.3

OpenCL version

2.0

DirectX version

12

Memory

Memory Type

LPDDR4X

Memory frequency

2133 MHz

Bus

4x 16 Bit

Max bandwidth

34.1 Gbit/s

Multimedia (ISP)

Neural processor (NPU)

Da Vinci

Storage type

UFS 2.1, UFS 3.0

Max display resolution

3360 x 1440

Video capture

4K at 60FPS

Video playback

4K at 60FPS

Video codecs

H.264, H.265, VC-1

Audio codecs

AIFF, CAF, MP3, MP4, WAV

Connectivity

4G support

LTE Cat. 19

5G support

No

Download speed

Up to 1400 Mbps

Upload speed

Up to 200 Mbps

Wi-Fi

6

Bluetooth

5.0

Navigation

GPS, GLONASS, Beidou, Galileo

Info

Announced

Oct 2019

Class

Flagship

Official page

Official Link ↗

Benchmarks

AnTuTu 10 695853

Geekbench 6 Single Core 990

Geekbench 6 Multi Core 3179

FP32 (float) 691

Performance Ranking

Geekbench 6 Single Core

85 Qualcomm Snapdragon 6s Gen 4 1008

86 Samsung Exynos 1380 1000

87 Qualcomm Snapdragon 860 996

88 MediaTek Dimensity 1050 995

89 HiSilicon Kirin 990 4G 990

90 Qualcomm Snapdragon 7 Gen 1 969

91 MediaTek Dimensity 1080 969

92 MediaTek Dimensity 7050 962

93 Qualcomm Snapdragon 6s Gen 3 940

Geekbench 6 Multi Core

68 Qualcomm Snapdragon 865 3277

69 MediaTek Dimensity 8050 3242

70 MediaTek Dimensity 1200 3198

71 MediaTek Dimensity 7400 3191

72 HiSilicon Kirin 990 4G 3179

73 Qualcomm Snapdragon 7s Gen 3 3146

74 MediaTek Dimensity 7300 3025

75 Qualcomm Snapdragon 6 Gen 4 3013

76 Qualcomm Snapdragon 778G Plus 3008

Related Comparisons

HiSilicon Kirin 990 4G vs MediaTek Dimensity 9400e HiSilicon Kirin 990 4G vs Qualcomm Snapdragon 4 Gen 2 HiSilicon Kirin 990 4G vs MediaTek Helio P65 HiSilicon Kirin 990 4G vs Qualcomm Snapdragon X Plus X1P 46 100 HiSilicon Kirin 990 4G vs Qualcomm Snapdragon 6 Gen 3 HiSilicon Kirin 990 4G vs HiSilicon Kirin 9000 HiSilicon Kirin 990 4G vs Google Tensor G3 HiSilicon Kirin 990 4G vs Unisoc Tiger T612