S
HiSilicon Kirin 970
SOC
The HiSilicon Kirin 970 is a SOC manufactured by , built on 's officially announced Yes process technology. This processor features a 8-core architecture design. The Thermal Design Power (TDP) is rated at 9 W. Overall specifications are targeted at mainstream high-performance application scenarios.
CPU
Report
Architecture
4x 2.36 GHz – Cortex A734x 1.84 GHz – Cortex A53
Frequency
2360 MHz
Cores
8
Instruction set
ARMv8-A
L1 cache
512 KB
L2 cache
0
L3 cache
0
Process
10 nm
Transistor count
5.5
TDP
9 W
Manufacturing
TSMC
Graphics
Report
GPU name
Mali-G72 MP12
GPU frequency
768 MHz
Execution units
12
Shading units
18
Vulkan version
1.3
OpenCL version
2.0
DirectX version
12
Memory
Report
Memory Type
LPDDR4X
Memory frequency
1866 MHz
Bus
4x 16 Bit
Max bandwidth
29.8 Gbit/s
Multimedia (ISP)
Report
Neural processor (NPU)
Yes
Storage type
UFS 2.1
Max display resolution
3120 x 1440
Max camera resolution
1x 48MP, 2x 20MP
Video capture
4K at 30FPS
Video playback
4K at 30FPS
Video codecs
H.264, H.265, VP8, VP9, VC-1
Audio codecs
32 bit@384 kHz, HD-audio
Connectivity
Report
4G support
LTE Cat. 18
5G support
No
Download speed
Up to 1200 Mbps
Upload speed
Up to 150 Mbps
Wi-Fi
5
Bluetooth
4.2
Navigation
GPS, GLONASS, Beidou, Galileo
Info
Report📊 Benchmark
AnTuTu 10 Single
355,946
Geekbench 6 Single
386
Geekbench 6 Multi
1,377
FP32 (float) Single
331