SOC
HiSilicon Kirin 960
About
The HiSilicon Kirin 960 is a SOC manufactured by , built on 's officially announced No process technology. This processor features a 8-core architecture design. The Thermal Design Power (TDP) is rated at 5 W. Overall specifications are targeted at mainstream high-performance application scenarios.
Specifications
CPU
Architecture
4x 2.36 GHz – Cortex-A734x 1.84 GHz – Cortex-A53
Frequency
2360 MHz
Cores
8
Instruction set
ARMv8-A
L1 cache
64 KB
L2 cache
0
Process
16 nm
Transistor count
4
TDP
5 W
Manufacturing
TSMC
Graphics
GPU name
Mali-G71 MP8
GPU frequency
1037 MHz
Execution units
8
Shading units
16
Vulkan version
1.3
OpenCL version
2.0
DirectX version
11.3
Memory
Memory Type
LPDDR4
Memory frequency
1600 MHz
Bus
2x 32 Bit
Max bandwidth
28.8 Gbit/s
Multimedia (ISP)
Neural processor (NPU)
No
Storage type
eMMC 5.1, UFS 2.1
Max display resolution
2560 x 1600
Max camera resolution
2x 16MP
Video capture
4K at 30FPS
Video playback
4K at 30FPS
Video codecs
H.264, H.265, VP8, VP9
Audio codecs
AIFF, CAF, MP3, MP4, WAV
Connectivity
4G support
LTE Cat. 12
5G support
No
Download speed
Up to 600 Mbps
Upload speed
Up to 150 Mbps
Wi-Fi
5
Bluetooth
4.2
Navigation
GPS, GLONASS, Beidou, Galileo
Info
Announced
Oct 2016
Class
Flagship
Model number
Hi3660
Benchmarks
Performance Ranking
Geekbench 6 Single Core
Geekbench 6 Multi Core
Related Comparisons
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HiSilicon Kirin 960 vs Qualcomm Snapdragon X2 Elite (X2E 84 100)
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