Qualcomm Snapdragon X2 Plus (X2P 64 100) vs HiSilicon Kirin 960
SOC Specs Compare
General Parameters
Release Date
Jan 2026
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Manufacturer
Qualcomm
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Type
Laptop
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Instruction Set
ARMv9
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Core Architecture
Snapdragon X
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Processor Number
X2P-64-100
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Integrated Graphics
Adreno X2-45
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Package
Manufacturing Process
3 nm
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Socket
Custom
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CPU Performance
Performance Cores
10
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Performance Core Threads
10
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Performance Core Base Frequency
3.4 GHz
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Performance Core Turbo Frequency
4.04 GHz
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Total Core Count
10
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Total Thread Count
10
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Multiplier
34
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L1 Cache
288 K per core
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Unlocked Multiplier
No
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Memory Parameters
Memory Types
LPDDR5X-9523
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Max Memory Bandwidth
152 GB/s
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ECC Memory Support
No
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Graphics Card Parameters
Integrated Graphics
true
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GPU Base Frequency
500 MHz
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GPU Max Dynamic Frequency
1700 MHz
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Miscellaneous
CPU
Architecture
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4x 2.36 GHz – Cortex-A734x 1.84 GHz – Cortex-A53
Frequency
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2360 MHz
Cores
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8
Instruction set
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ARMv8-A
L1 cache
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64 KB
L2 cache
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0
Process
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16 nm
Transistor count
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4
TDP
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5 W
Manufacturing
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TSMC
Graphics
GPU name
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Mali-G71 MP8
GPU frequency
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1037 MHz
Execution units
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8
Shading units
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16
Vulkan version
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1.3
OpenCL version
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2.0
DirectX version
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11.3
Memory
Memory Type
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LPDDR4
Memory frequency
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1600 MHz
Bus
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2x 32 Bit
Max bandwidth
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28.8 Gbit/s
Multimedia (ISP)
Neural processor (NPU)
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No
Storage type
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eMMC 5.1, UFS 2.1
Max display resolution
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2560 x 1600
Max camera resolution
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2x 16MP
Video capture
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4K at 30FPS
Video playback
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4K at 30FPS
Video codecs
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H.264, H.265, VP8, VP9
Audio codecs
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AIFF, CAF, MP3, MP4, WAV
Connectivity
4G support
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LTE Cat. 12
5G support
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No
Download speed
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Up to 600 Mbps
Upload speed
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Up to 150 Mbps
Wi-Fi
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5
Bluetooth
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4.2
Navigation
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GPS, GLONASS, Beidou, Galileo
Info
Announced
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Oct 2016
Class
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Flagship
Model number
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Hi3660
📊 Benchmark
Geekbench 6
3,278
408
Geekbench 6
14,380
1,385
Cinebench 2024
120
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Cinebench 2024
889
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AnTuTu 10
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278,916
FP32 (float)
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265