Product Compare

Qualcomm Snapdragon X2 Plus (X2P 64 100) vs HiSilicon Kirin 960

SOC SOC
General Parameters
Release Date Jan 2026
Manufacturer Qualcomm
Type Laptop
Instruction Set ARMv9
Core Architecture Snapdragon X
Processor Number X2P-64-100
Integrated Graphics Adreno X2-45
Package
Manufacturing Process 3 nm
Socket Custom
CPU Performance
Performance Cores 10
Performance Core Threads 10
Performance Core Base Frequency 3.4 GHz
Performance Core Turbo Frequency 4.04 GHz
Total Core Count 10
Total Thread Count 10
Multiplier 34
L1 Cache 288 K per core
Unlocked Multiplier No
Memory Parameters
Memory Types LPDDR5X-9523
Max Memory Bandwidth 152 GB/s
ECC Memory Support No
Graphics Card Parameters
Integrated Graphics true
GPU Base Frequency 500 MHz
GPU Max Dynamic Frequency 1700 MHz
Miscellaneous
Official Website Official Link ↗
CPU
Architecture 4x 2.36 GHz – Cortex-A734x 1.84 GHz – Cortex-A53
Frequency 2360 MHz
Cores 8
Instruction set ARMv8-A
L1 cache 64 KB
L2 cache 0
Process 16 nm
Transistor count 4
TDP 5 W
Manufacturing TSMC
Graphics
GPU name Mali-G71 MP8
GPU frequency 1037 MHz
Execution units 8
Shading units 16
Vulkan version 1.3
OpenCL version 2.0
DirectX version 11.3
Memory
Memory Type LPDDR4
Memory frequency 1600 MHz
Bus 2x 32 Bit
Max bandwidth 28.8 Gbit/s
Multimedia (ISP)
Neural processor (NPU) No
Storage type eMMC 5.1, UFS 2.1
Max display resolution 2560 x 1600
Max camera resolution 2x 16MP
Video capture 4K at 30FPS
Video playback 4K at 30FPS
Video codecs H.264, H.265, VP8, VP9
Audio codecs AIFF, CAF, MP3, MP4, WAV
Connectivity
4G support LTE Cat. 12
5G support No
Download speed Up to 600 Mbps
Upload speed Up to 150 Mbps
Wi-Fi 5
Bluetooth 4.2
Navigation GPS, GLONASS, Beidou, Galileo
Info
Announced Oct 2016
Class Flagship
Model number Hi3660
Benchmarks
Geekbench 6 Single Core 3278 408
Geekbench 6 Multi Core 14380 1385