MediaTek Helio G70 vs Qualcomm Snapdragon X2 Plus (X2P 42 100)
SOC Specs Compare
CPU
Architecture
2x 2 GHz – Cortex-A756x 1.7 GHz – Cortex-A55
-
Frequency
2000 MHz
-
Cores
8
-
Instruction set
ARMv8-A
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L2 cache
0
-
L3 cache
0
-
Process
12 nm
-
Transistor count
5.5
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TDP
5 W
-
Manufacturing
TSMC
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Graphics
GPU name
Mali-G52 MP2
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GPU frequency
820 MHz
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Execution units
2
-
Shading units
24
-
Vulkan version
1.3
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OpenCL version
2.0
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DirectX version
12
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Memory
Memory Type
LPDDR4X
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Memory frequency
1800 MHz
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Bus
2x 16 Bit
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Max bandwidth
13.41 Gbit/s
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Multimedia (ISP)
Neural processor (NPU)
Yes
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Storage type
eMMC 5.1
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Max display resolution
2520 x 1080
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Max camera resolution
1x 48MP, 2x 16MP
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Video capture
2K at 30FPS
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Video playback
2K at 30FPS
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Video codecs
H.264, H.265, VP9
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Audio codecs
AIFF, CAF, MP3, MP4, WAV
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Connectivity
4G support
LTE Cat. 7
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5G support
No
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Download speed
Up to 300 Mbps
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Upload speed
Up to 100 Mbps
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Wi-Fi
5
-
Bluetooth
5.0
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Navigation
GPS, GLONASS, Beidou, Galileo
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Info
General Parameters
Release Date
-
Jan 2026
Manufacturer
-
Qualcomm
Type
-
Laptop
Instruction Set
-
ARMv9
Core Architecture
-
Snapdragon X
Processor Number
-
X2P-42-100
Integrated Graphics
-
Qualcomm Adreno X1-45
Package
Manufacturing Process
-
3 nm
Socket
-
Custom
Power Consumption
-
10 W
Max Turbo Power Consumption
-
22 W
CPU Performance
Performance Cores
-
6
Performance Core Threads
-
6
Performance Core Base Frequency
-
3.4 GHz
Performance Core Turbo Frequency
-
4.04 GHz
Total Core Count
-
6
Total Thread Count
-
6
Multiplier
-
34
Unlocked Multiplier
-
No
Memory Parameters
Memory Types
-
LPDDR5X-9523
Max Memory Bandwidth
-
152 GB/s
ECC Memory Support
-
No
Graphics Card Parameters
Integrated Graphics
-
true
GPU Base Frequency
-
280 MHz
GPU Max Dynamic Frequency
-
910 MHz
Shader Units
-
768
Texture Units
-
48
Raster Operation Units
-
24
Execution Units
-
3
Miscellaneous
📊 Benchmark
AnTuTu 10
249,042
-
Geekbench 6
418
3,239
Geekbench 6
1,347
11,952
FP32 (float)
78
-
Cinebench 2024
-
119
Cinebench 2024
-
752