Product Compare

HiSilicon Kirin 990 5G vs Qualcomm Snapdragon X Plus X1P 46 100

SOC SOC
CPU
Architecture 2x 2.86 GHz – Cortex-A762x 2.36 GHz – Cortex-A764x 1.95 GHz – Cortex-A55
Frequency 2860 MHz
Cores 8
Instruction set ARMv8.2-A
L1 cache 512 KB
L2 cache 0
Process 7 nm
Transistor count 8
TDP 6 W
Manufacturing TSMC
Graphics
GPU name Mali-G76 MP16
GPU frequency 600 MHz
Execution units 16
Shading units 36
Vulkan version 1.3
OpenCL version 2.0
DirectX version 12
Memory
Memory Type LPDDR4X
Memory frequency 2133 MHz
Bus 4x 16 Bit
Max bandwidth 34.1 Gbit/s
Multimedia (ISP)
Neural processor (NPU) Da Vinci
Storage type UFS 2.1, UFS 3.0
Max display resolution 3360 x 1440
Video capture 4K at 60FPS
Video playback 4K at 60FPS
Video codecs H.264, H.265, VC-1
Audio codecs AIFF, CAF, MP3, MP4, WAV
Connectivity
4G support LTE Cat. 24
5G support Yes
Download speed Up to 4600 Mbps
Upload speed Up to 1250 Mbps
Wi-Fi 6
Bluetooth 5.0
Navigation GPS, GLONASS, Beidou
Info
Announced Oct 2019
Class Flagship
Official page Official Link ↗
General Parameters
Release Date Sep 2024
Manufacturer Qualcomm
Type Laptop
Instruction Set ARMv9
Core Architecture Snapdragon X
Processor Number X1P-46-100
Integrated Graphics Qualcomm Adreno X1-45
Package
Manufacturing Process 4 nm
Socket Custom
CPU Performance
Performance Cores 8
Performance Core Threads 8
Performance Core Base Frequency 3.4 GHz
Performance Core Turbo Frequency 4 GHz
Total Core Count 8
Total Thread Count 8
Multiplier 34
Unlocked Multiplier No
Memory Parameters
Memory Types LPDDR5X-8448
Max Memory Size 64 GB
Max Memory Channels 8
Max Memory Bandwidth 135 GB/s
ECC Memory Support No
Graphics Card Parameters
Integrated Graphics true
GPU Base Frequency 280 MHz
GPU Max Dynamic Frequency 1367 MHz
Shader Units 1024
Texture Units 48
Raster Operation Units 24
Execution Units 3
Power Consumption 30
Miscellaneous
Official Website Official Link ↗
PCIe Version 4.0