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HiSilicon Kirin 810
SOC
The HiSilicon Kirin 810 is a SOC manufactured by , built on 's officially announced Yes process technology. This processor features a 8-core architecture design. The Thermal Design Power (TDP) is rated at 5 W. Overall specifications are targeted at mainstream high-performance application scenarios.
CPU
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Architecture
2x 2.27 GHz – Cortex-A766x 1.9 GHz – Cortex-A55
Frequency
2270 MHz
Cores
8
Instruction set
ARMv8.2-A
L1 cache
256 KB
L2 cache
0
Process
7 nm
Transistor count
6.9
TDP
5 W
Graphics
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GPU name
Mali-G52 MP6
GPU frequency
820 MHz
Execution units
6
Shading units
24
Vulkan version
1.3
OpenCL version
2.0
DirectX version
12
Memory
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Memory Type
LPDDR4X
Memory frequency
2133 MHz
Bus
4x 16 Bit
Max bandwidth
31.78 Gbit/s
Multimedia (ISP)
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Neural processor (NPU)
Yes
Storage type
eMMC 5.1, UFS 2.1
Max display resolution
3840 x 2160
Max camera resolution
1x 48MP, 2x 20MP
Video capture
1K at 30FPS
Video playback
1080p at 60FPS
Video codecs
H.264, H.265
Audio codecs
AIFF, CAF, MP3, MP4, WAV
Connectivity
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4G support
LTE Cat. 12
5G support
No
Download speed
Up to 600 Mbps
Upload speed
Up to 150 Mbps
Wi-Fi
6
Bluetooth
5.0
Navigation
GPS, GLONASS, Beidou, Galileo
Info
Report📊 Benchmark
Geekbench 6 Single
778
Geekbench 6 Multi
1,992