C
AMD Ryzen AI 9 HX PRO 475
CPU
AMD
Jan 2026 Released
The AMD Ryzen AI 9 HX PRO 475 is a laptop-class CPU manufactured by AMD, built on AMD's officially announced 4 nm process technology, released in January 2026. This processor features a 12-core 24-thread architecture design, with a base clock of 2.0 GHz and a maximum boost clock reaching up to 3.3 GHz, equipped with 24 MB of L3 cache, utilizing the AMD Socket FP8 socket. Overall specifications are targeted at laptop application scenarios.
General Parameters
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Release Date
Jan 2026
Manufacturer
AMD
Type
Laptop
Core Architecture
Gorgon Point
Integrated Graphics
Radeon 890M
Generation
Ryzen AI 400 (Zen 5 / Zen 5c)
Series
Ryzen AI PRO 400 Series
Package
Report
Manufacturing Process
4 nm
Socket
AMD Socket FP8
Power Consumption
28 W
Peak Operating Temperature
100°C
Foundry
TSMC
Die Size
233 mm²
Package
FP8
CPU Performance
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Performance Cores
4
Performance Core Threads
8
Performance Core Base Frequency
2 GHz
Performance Core Turbo Frequency
5.2 GHz
Efficiency Cores
8
Efficiency Core Threads
16
Efficiency Core Base Frequency
2.0 GHz
Efficiency Core Turbo Frequency
3.3 GHz
Total Core Count
12
Total Thread Count
24
Bus Frequency
100 MHz
Multiplier
20.0
L1 Cache
80 KB per core
L2 Cache
1 MB per core
L3 Cache
24 MB
Unlocked Multiplier
No
SMP
1
Memory Parameters
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Memory Types
DDR5-5600, LPDDR5X-8533
Max Memory Size
256 GB
Max Memory Channels
2
Max Memory Bandwidth
136.5 GB/s
ECC Memory Support
Yes
Graphics Card Parameters
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Integrated Graphics
true
GPU Max Dynamic Frequency
3100 MHz
Execution Units
16
AI Accelerator
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NPU
AMD Ryzen™ AI
Theoretical performance
60 TOPS