Product Compare

Qualcomm Snapdragon X Plus vs HiSilicon Kirin 9000S

SOC SOC
General Parameters
Release Date Apr 2024
Manufacturer Qualcomm
Type Laptop
Instruction Set ARMv9
Core Architecture Snapdragon X
Processor Number X1P-64-100
Integrated Graphics Qualcomm Adreno X1
Generation Oryon
Package
Manufacturing Process 4 nm
Socket Custom
Power Consumption 23 W
Max Turbo Power Consumption 80 W
Foundry Samsung TSMC
Die Size mm²
CPU Performance
Performance Cores 10
Performance Core Threads 10
Performance Core Base Frequency 3.4 GHz
Performance Core Turbo Frequency 3.4 GHz
Total Core Count 10
Total Thread Count 10
Bus Frequency 100 MHz
Multiplier 34x
L3 Cache 42 MB
Unlocked Multiplier No
SMP 1
Memory Parameters
Memory Types LPDDR5X-8448
Max Memory Size 64 GB
Max Memory Channels 8
Max Memory Bandwidth 135 GB/s
ECC Memory Support No
Graphics Card Parameters
Integrated Graphics true
GPU Base Frequency 500 MHz
GPU Max Dynamic Frequency 1200 MHz
Shader Units 1536
Texture Units 48
Raster Operation Units 6
Execution Units 6
Miscellaneous
Official Website Official Link ↗
PCIe Version 4.0
CPU
Architecture 1x 2.62 GHz – TaiShan V1203x 2.15 GHz – TaiShan V1204x 1.53 GHz – Cortex-A510
Frequency 2620 MHz
Cores 8
Instruction set ARMv8-A
Process 7 nm
TDP 7 W
Manufacturing SMIC
Graphics
GPU name Maleoon 910
GPU frequency 750 MHz
Memory
Memory Type LPDDR5
Memory frequency 2750 MHz
Bus 4x 16 Bit
Max bandwidth 44 Gbit/s
Multimedia (ISP)
Neural processor (NPU) Yes
Storage type UFS 3.1, UFS 4.0
Max display resolution 3840 x 2160
Video capture 4K at 60FPS
Video playback 4K at 60FPS
Video codecs H.264, H.265, VP9
Audio codecs AAC, AIFF, CAF, MP3, MP4, WAV
Connectivity
4G support LTE Cat. 24
5G support Yes
Download speed Up to 4600 Mbps
Upload speed Up to 2500 Mbps
Wi-Fi 6
Bluetooth 5.2
Navigation GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Info
Announced Aug 2023
Class Flagship
Model number Hi36A0
Benchmarks
Geekbench 6 Single Core 2347 1334
Geekbench 6 Multi Core 12973 4128