Product Compare

MediaTek Dimensity 7060 vs Qualcomm Snapdragon X2 Plus (X2P 42 100)

SOC SOC
CPU
Architecture 2x 2.6 GHz – Cortex-A786x 2 GHz – Cortex-A55
Frequency 2600 MHz
Cores 8
Instruction set ARMv8.2-A
Process 6 nm
Manufacturing TSMC
Graphics
GPU name Mali-G68 MP4
GPU frequency 950 MHz
Shading units 32
Vulkan version 1.3
OpenCL version 2.0
Memory
Memory Type LPDDR5
Memory frequency 3200 MHz
Bus 2x 16 Bit
Max bandwidth 51.2 Gbit/s
AI
NPU MediaTek APU 550
Multimedia (ISP)
Storage type UFS 2.1, UFS 2.2, UFS 3.0, UFS 3.1
Max display resolution 2520 x 1080
Max camera resolution 1x 200MP
Video capture 4K at 30FPS
Video playback 4K at 30FPS
Video codecs - H.264- H.265- VP9
Audio codecs - AAC- AIFF- CAF- MP3- MP4- WAV
Connectivity
4G support LTE Cat. 18
5G support Yes
Download speed Up to 2770 Mbps
Upload speed Up to 1250 Mbps
Wi-Fi 6
Bluetooth 5.2
Navigation GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Info
Announced May 2025
Class Mid range
General Parameters
Release Date Jan 2026
Manufacturer Qualcomm
Type Laptop
Instruction Set ARMv9
Core Architecture Snapdragon X
Processor Number X2P-42-100
Integrated Graphics Qualcomm Adreno X1-45
Package
Manufacturing Process 3 nm
Socket Custom
Power Consumption 10 W
Max Turbo Power Consumption 22 W
CPU Performance
Performance Cores 6
Performance Core Threads 6
Performance Core Base Frequency 3.4 GHz
Performance Core Turbo Frequency 4.04 GHz
Total Core Count 6
Total Thread Count 6
Multiplier 34
Unlocked Multiplier No
Memory Parameters
Memory Types LPDDR5X-9523
Max Memory Bandwidth 152 GB/s
ECC Memory Support No
Graphics Card Parameters
Integrated Graphics true
GPU Base Frequency 280 MHz
GPU Max Dynamic Frequency 910 MHz
Shader Units 768
Texture Units 48
Raster Operation Units 24
Execution Units 3
Miscellaneous
Official Website Official Link ↗
Benchmarks
Geekbench 6 Single Core 1009 3239
Geekbench 6 Multi Core 2413 11952