HiSilicon Kirin 9000S vs Qualcomm Snapdragon X Plus X1P 46 100

SOC Specs Compare

CPU

Architecture
1x 2.62 GHz – TaiShan V1203x 2.15 GHz – TaiShan V1204x 1.53 GHz – Cortex-A510
-
Frequency
2620 MHz
-
Cores
8
-
Instruction set
ARMv8-A
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Process
7 nm
-
TDP
7 W
-
Manufacturing
SMIC
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Graphics

GPU name
Maleoon 910
-
GPU frequency
750 MHz
-

Memory

Memory Type
LPDDR5
-
Memory frequency
2750 MHz
-
Bus
4x 16 Bit
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Max bandwidth
44 Gbit/s
-

Multimedia (ISP)

Neural processor (NPU)
Yes
-
Storage type
UFS 3.1, UFS 4.0
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Max display resolution
3840 x 2160
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Video capture
4K at 60FPS
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Video playback
4K at 60FPS
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Video codecs
H.264, H.265, VP9
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Audio codecs
AAC, AIFF, CAF, MP3, MP4, WAV
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Connectivity

4G support
LTE Cat. 24
-
5G support
Yes
-
Download speed
Up to 4600 Mbps
-
Upload speed
Up to 2500 Mbps
-
Wi-Fi
6
-
Bluetooth
5.2
-
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
-

Info

Announced
Aug 2023
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Class
Flagship
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Model number
Hi36A0
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General Parameters

Release Date
-
Sep 2024
Manufacturer
-
Qualcomm
Type
-
Laptop
Instruction Set
-
ARMv9
Core Architecture
-
Snapdragon X
Processor Number
-
X1P-46-100
Integrated Graphics
-
Qualcomm Adreno X1-45

Package

Manufacturing Process
-
4 nm
Socket
-
Custom

CPU Performance

Performance Cores
-
8
Performance Core Threads
-
8
Performance Core Base Frequency
-
3.4 GHz
Performance Core Turbo Frequency
-
4 GHz
Total Core Count
-
8
Total Thread Count
-
8
Multiplier
-
34
Unlocked Multiplier
-
No

Memory Parameters

Memory Types
-
LPDDR5X-8448
Max Memory Size
-
64 GB
Max Memory Channels
-
8
Max Memory Bandwidth
-
135 GB/s
ECC Memory Support
-
No

Graphics Card Parameters

Integrated Graphics
-
true
GPU Base Frequency
-
280 MHz
GPU Max Dynamic Frequency
-
1367 MHz
Shader Units
-
1024
Texture Units
-
48
Raster Operation Units
-
24
Execution Units
-
3
Power Consumption
-
30

Miscellaneous

Official Website
-
PCIe Version
-
4.0

📊 Benchmark

AnTuTu 10
903,932
-
Geekbench 6
1,334
2,423
Geekbench 6
4,128
11,351
Cinebench R23
-
1,150
Cinebench R23
-
6,893