HiSilicon Kirin 9000 vs Qualcomm Snapdragon X2 Elite Extreme (X2E 96 100)
SOC Specs Compare
CPU
Architecture
1x 3.13 GHz – Cortex-A773x 2.54 GHz – Cortex-A774x 2.05 GHz – Cortex-A55
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Frequency
3130 MHz
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Cores
8
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Instruction set
ARMv8.2-A
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Process
5 nm
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Transistor count
15.3
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TDP
6 W
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Manufacturing
TSMC
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Graphics
GPU name
Mali-G78 MP24
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GPU frequency
759 MHz
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Execution units
24
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Shading units
64
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Vulkan version
1.3
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OpenCL version
2.0
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DirectX version
12
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Memory
Memory Type
LPDDR5
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Memory frequency
2750 MHz
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Bus
4x 16 Bit
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Max bandwidth
44 Gbit/s
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Multimedia (ISP)
Neural processor (NPU)
AI accelerator
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Storage type
UFS 3.1
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Max display resolution
3840 x 2160
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Video capture
4K at 60FPS
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Video playback
4K at 60FPS
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Video codecs
H.264, H.265, VP9
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Audio codecs
AAC, AIFF, CAF, MP3, MP4, WAV
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Connectivity
4G support
LTE Cat. 24
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5G support
Yes
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Download speed
Up to 4600 Mbps
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Upload speed
Up to 2500 Mbps
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Wi-Fi
6
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Bluetooth
5.2
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Navigation
GPS, GLONASS, Beidou, Galileo, NAVIC
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Info
General Parameters
Release Date
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Sep 2025
Manufacturer
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Qualcomm
Type
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Laptop
Instruction Set
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ARMv9
Core Architecture
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Snapdragon X
Processor Number
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X2-96-100
Integrated Graphics
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Adreno X2-90
Package
Manufacturing Process
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3 nm
Socket
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Custom
Power Consumption
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96 W
CPU Performance
Performance Cores
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18
Performance Core Threads
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18
Performance Core Base Frequency
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3.0 GHz
Performance Core Turbo Frequency
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5 GHz
Total Core Count
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18
Total Thread Count
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18
Bus Frequency
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100 MHz
Multiplier
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30
Unlocked Multiplier
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No
Memory Parameters
Memory Types
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LPDDR5X-9523
Max Memory Bandwidth
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228 GB/s
ECC Memory Support
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No
Graphics Card Parameters
Integrated Graphics
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true
GPU Base Frequency
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500 MHz
GPU Max Dynamic Frequency
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1850 MHz
Shader Units
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2048
Texture Units
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128
Raster Operation Units
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64
Execution Units
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12
Miscellaneous
PCIe Version
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5.0
📊 Benchmark
Geekbench 6
1,266
4,003
Geekbench 6
3,529
23,081
FP32 (float)
2,331
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