Product Compare

HiSilicon Kirin 810 vs Qualcomm Snapdragon X2 Elite Extreme (X2E 96 100)

SOC SOC
CPU
Architecture 2x 2.27 GHz – Cortex-A766x 1.9 GHz – Cortex-A55
Frequency 2270 MHz
Cores 8
Instruction set ARMv8.2-A
L1 cache 256 KB
L2 cache 0
Process 7 nm
Transistor count 6.9
TDP 5 W
Graphics
GPU name Mali-G52 MP6
GPU frequency 820 MHz
Execution units 6
Shading units 24
Vulkan version 1.3
OpenCL version 2.0
DirectX version 12
Memory
Memory Type LPDDR4X
Memory frequency 2133 MHz
Bus 4x 16 Bit
Max bandwidth 31.78 Gbit/s
Multimedia (ISP)
Neural processor (NPU) Yes
Storage type eMMC 5.1, UFS 2.1
Max display resolution 3840 x 2160
Max camera resolution 1x 48MP, 2x 20MP
Video capture 1K at 30FPS
Video playback 1080p at 60FPS
Video codecs H.264, H.265
Audio codecs AIFF, CAF, MP3, MP4, WAV
Connectivity
4G support LTE Cat. 12
5G support No
Download speed Up to 600 Mbps
Upload speed Up to 150 Mbps
Wi-Fi 6
Bluetooth 5.0
Navigation GPS, GLONASS, Beidou, Galileo
Info
Announced Jun 2019
Class Mid range
Model number Hi6280
Official page Official Link ↗
General Parameters
Release Date Sep 2025
Manufacturer Qualcomm
Type Laptop
Instruction Set ARMv9
Core Architecture Snapdragon X
Processor Number X2-96-100
Integrated Graphics Adreno X2-90
Package
Manufacturing Process 3 nm
Socket Custom
Power Consumption 96 W
CPU Performance
Performance Cores 18
Performance Core Threads 18
Performance Core Base Frequency 3.0 GHz
Performance Core Turbo Frequency 5 GHz
Total Core Count 18
Total Thread Count 18
Bus Frequency 100 MHz
Multiplier 30
Unlocked Multiplier No
Memory Parameters
Memory Types LPDDR5X-9523
Max Memory Bandwidth 228 GB/s
ECC Memory Support No
Graphics Card Parameters
Integrated Graphics true
GPU Base Frequency 500 MHz
GPU Max Dynamic Frequency 1850 MHz
Shader Units 2048
Texture Units 128
Raster Operation Units 64
Execution Units 12
Miscellaneous
Official Website Official Link ↗
PCIe Version 5.0
Benchmarks
Geekbench 6 Single Core 778 4003
Geekbench 6 Multi Core 1992 23081