Qualcomm Snapdragon X2 Plus (X2P 42 100) vs HiSilicon Kirin 8000
SOC Specs Compare
General Parameters
Release Date
Jan 2026
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Manufacturer
Qualcomm
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Type
Laptop
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Instruction Set
ARMv9
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Core Architecture
Snapdragon X
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Processor Number
X2P-42-100
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Integrated Graphics
Qualcomm Adreno X1-45
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Package
Manufacturing Process
3 nm
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Socket
Custom
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Power Consumption
10 W
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Max Turbo Power Consumption
22 W
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CPU Performance
Performance Cores
6
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Performance Core Threads
6
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Performance Core Base Frequency
3.4 GHz
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Performance Core Turbo Frequency
4.04 GHz
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Total Core Count
6
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Total Thread Count
6
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Multiplier
34
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Unlocked Multiplier
No
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Memory Parameters
Memory Types
LPDDR5X-9523
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Max Memory Bandwidth
152 GB/s
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ECC Memory Support
No
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Graphics Card Parameters
Integrated Graphics
true
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GPU Base Frequency
280 MHz
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GPU Max Dynamic Frequency
910 MHz
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Shader Units
768
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Texture Units
48
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Raster Operation Units
24
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Execution Units
3
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Miscellaneous
CPU
Architecture
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1x 2.4 GHz – 1xA77 H3x 2.19 GHz – 1xA77 L4x 1.84 GHz – A55
Frequency
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2400 MHz
Cores
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8
Instruction set
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ARMv8.2-A
Process
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7 nm
Manufacturing
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SMIC
Graphics
GPU name
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Mali-G610 MP4
GPU frequency
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864 MHz
Shading units
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128
Vulkan version
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1.3
OpenCL version
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2.0
Memory
Memory Type
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LPDDR5
Memory frequency
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3200 MHz
Bus
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4x 16 Bit
Max bandwidth
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51.2 Gbit/s
AI
NPU
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Yes
Multimedia (ISP)
Storage type
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UFS 2.2, UFS 3.1
Video capture
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4K at 30FPS, 1K at 60FPS
Video playback
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4K at 30FPS, 1080p at 60FPS
Video codecs
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- H.264- H.265- VP9
Audio codecs
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- AAC- AIFF- CAF- MP3- MP4- WAV
Connectivity
5G support
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Yes
Wi-Fi
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6
Bluetooth
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5.2
Navigation
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GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Info
Announced
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Oct 2024
Class
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Mid range
📊 Benchmark
Geekbench 6
3,239
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Geekbench 6
11,952
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Cinebench 2024
119
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Cinebench 2024
752
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