Product Compare

Qualcomm Snapdragon X Plus (X1P-64-100) vs HiSilicon Kirin 8000

SOC SOC
General Parameters
Release Date Apr 2024
Manufacturer Qualcomm
Type Laptop
Instruction Set ARMv9
Core Architecture Snapdragon X
Processor Number X1P-64-100
Integrated Graphics Qualcomm Adreno X1
Package
Manufacturing Process 4 nm
Socket Custom
Power Consumption 23 W
CPU Performance
Performance Cores 10
Performance Core Threads 10
Performance Core Base Frequency 3.4 GHz
Total Core Count 10
Total Thread Count 10
Multiplier 34x
L3 Cache 42 MB
Unlocked Multiplier No
Memory Parameters
Memory Types LPDDR5X-8448
Max Memory Size 64 GB
Max Memory Channels 8
Max Memory Bandwidth 135 GB/s
ECC Memory Support No
Graphics Card Parameters
Integrated Graphics true
GPU Base Frequency 500 MHz
GPU Max Dynamic Frequency 1200 MHz
Shader Units 1536
Texture Units 48
Raster Operation Units 6
Execution Units 6
AI Accelerator
NPU Qualcomm Hexagon NPU
Theoretical performance 45 TOPS
Miscellaneous
Official Website Official Link ↗
PCIe Version 4.0
CPU
Architecture 1x 2.4 GHz – 1xA77 H3x 2.19 GHz – 1xA77 L4x 1.84 GHz – A55
Frequency 2400 MHz
Cores 8
Instruction set ARMv8.2-A
Process 7 nm
Manufacturing SMIC
Graphics
GPU name Mali-G610 MP4
GPU frequency 864 MHz
Shading units 128
Vulkan version 1.3
OpenCL version 2.0
Memory
Memory Type LPDDR5
Memory frequency 3200 MHz
Bus 4x 16 Bit
Max bandwidth 51.2 Gbit/s
AI
NPU Yes
Multimedia (ISP)
Storage type UFS 2.2, UFS 3.1
Video capture 4K at 30FPS, 1K at 60FPS
Video playback 4K at 30FPS, 1080p at 60FPS
Video codecs - H.264- H.265- VP9
Audio codecs - AAC- AIFF- CAF- MP3- MP4- WAV
Connectivity
5G support Yes
Wi-Fi 6
Bluetooth 5.2
Navigation GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Info
Announced Oct 2024
Class Mid range