Product Compare

MediaTek Helio G37 vs Qualcomm Snapdragon X Plus

SOC SOC
CPU
Architecture 4x 2.3 GHz – Cortex-A534x 1.8 GHz – Cortex-A53
Frequency 2300 MHz
Cores 8
Instruction set ARMv8.2-A
Process 12 nm
TDP 2.2 W
Manufacturing TSMC
Graphics
GPU name PowerVR GE8320
GPU frequency 680 MHz
Execution units 4
Shading units 8
Vulkan version 1.1
OpenCL version 1.2
DirectX version 12
Memory
Memory Type LPDDR4X
Memory frequency 1600 MHz
Bus 2x 16 Bit
Max bandwidth 13.9 Gbit/s
Multimedia (ISP)
Neural processor (NPU) No
Storage type eMMC 5.1
Max display resolution 2400 x 1080
Max camera resolution 1x 50MP, 2x 13MP
Video capture 1K at 30FPS
Video playback 1080p at 30FPS
Video codecs H.264, H.265
Audio codecs AIFF, CAF, MP3, MP4, WAV
Connectivity
4G support LTE Cat. 7
5G support No
Download speed Up to 300 Mbps
Upload speed Up to 150 Mbps
Wi-Fi 5
Bluetooth 5.0
Navigation GPS, GLONASS, Beidou, Galileo, QZSS
Info
Announced Jun 2020
Class Low end
Model number MT6765H
Official page Official Link ↗
General Parameters
Release Date Apr 2024
Manufacturer Qualcomm
Type Laptop
Instruction Set ARMv9
Core Architecture Snapdragon X
Processor Number X1P-64-100
Integrated Graphics Qualcomm Adreno X1
Generation Oryon
Package
Manufacturing Process 4 nm
Socket Custom
Power Consumption 23 W
Max Turbo Power Consumption 80 W
Foundry Samsung TSMC
Die Size mm²
CPU Performance
Performance Cores 10
Performance Core Threads 10
Performance Core Base Frequency 3.4 GHz
Performance Core Turbo Frequency 3.4 GHz
Total Core Count 10
Total Thread Count 10
Bus Frequency 100 MHz
Multiplier 34x
L3 Cache 42 MB
Unlocked Multiplier No
SMP 1
Memory Parameters
Memory Types LPDDR5X-8448
Max Memory Size 64 GB
Max Memory Channels 8
Max Memory Bandwidth 135 GB/s
ECC Memory Support No
Graphics Card Parameters
Integrated Graphics true
GPU Base Frequency 500 MHz
GPU Max Dynamic Frequency 1200 MHz
Shader Units 1536
Texture Units 48
Raster Operation Units 6
Execution Units 6
Miscellaneous
Official Website Official Link ↗
PCIe Version 4.0