Product Compare

MediaTek Helio G25 vs Qualcomm Snapdragon X X1 26 100

SOC SOC
CPU
Architecture 4x 2 GHz – Cortex-A534x 1.5 GHz – Cortex-A53
Frequency 2000 MHz
Cores 8
Instruction set ARMv8.2-A
Process 12 nm
TDP 2 W
Manufacturing TSMC
Graphics
GPU name PowerVR GE8320
GPU frequency 650 MHz
Execution units 4
Shading units 8
Vulkan version 1.1
OpenCL version 1.2
DirectX version 12
Memory
Memory Type LPDDR4X
Memory frequency 1600 MHz
Bus 2x 16 Bit
Max bandwidth 13.9 Gbit/s
Multimedia (ISP)
Neural processor (NPU) No
Storage type eMMC 5.1
Max display resolution 2400 x 1080
Max camera resolution 1x 21MP, 2x 13MP
Video capture 1K at 30FPS
Video playback 1080p at 30FPS
Video codecs H.264, H.265
Audio codecs AIFF, CAF, MP3, MP4, WAV
Connectivity
4G support LTE Cat. 7
5G support No
Download speed Up to 300 Mbps
Upload speed Up to 150 Mbps
Wi-Fi 5
Bluetooth 5.0
Navigation GPS, GLONASS, Beidou, Galileo
Info
Announced Jun 2020
Class Low end
Model number MT6762G
Official page Official Link ↗
General Parameters
Release Date Jan 2025
Manufacturer Qualcomm
Type Laptop
Instruction Set ARMv9
Core Architecture Snapdragon X
Processor Number X1-26-100
Integrated Graphics Qualcomm Adreno X1-45
Package
Manufacturing Process 4 nm
Socket Custom
Power Consumption 15-30 W
CPU Performance
Performance Cores 8
Performance Core Threads 8
Performance Core Base Frequency 2.98 GHz
Total Core Count 8
Total Thread Count 8
Multiplier 29
L2 Cache 1536 K per core
L3 Cache 6 MB shared
Unlocked Multiplier No
Memory Parameters
Memory Types LPDDR5X-8448
Max Memory Size 64 GB
Max Memory Channels 8
Max Memory Bandwidth 135 GB/s
ECC Memory Support No
Graphics Card Parameters
Integrated Graphics true
GPU Base Frequency 280 MHz
GPU Max Dynamic Frequency 1107 MHz
Shader Units 1024
Texture Units 48
Raster Operation Units 24
Execution Units 3
Power Consumption 30
Miscellaneous
Official Website Official Link ↗
PCIe Version 4.0
Benchmarks
Geekbench 6 Single Core 186 2121
Geekbench 6 Multi Core 524 10516